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1. Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.

by Lau, John H | Lee, S. W. Ricky.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York : McGraw-Hill, c2001Availability: Items available for loan: Siddeswari Campus Library [Call number: 621.3815 LAM] (9). Items available for reference: [Call number: 621.3815 LAM] (2).
2. Microelectronics interconnection and packaging / edited by Jerry Lyman.

by Lyman, Jerry, 1926-.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York : McGraw-Hill, c1980Availability: Items available for loan: Siddeswari Campus Library [Call number: 621.38173 MIC] (7). Items available for reference: [Call number: 621.38173 MIC] (2).
3. Electronic packaging, microelectronics, and interconnection dictionary / Charles A. Harper, Martin B. Miller.

by Harper, Charles A | Miller, Martin B. (Martin Boniface), 1924-.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: New York : McGraw-Hill, c1993Availability: Items available for reference: [Call number: 530 HAE] (1).

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